MSE 5420
Last Updated
- Schedule of Classes - February 16, 2018 10:59AM EST
- Course Catalog - February 12, 2018 11:18AM EST
Classes
MSE 5420
Course Description
Course information provided by the 2017-2018 Catalog.
Design, materials, and manufacturing needs for flexible electronics from chip to board. Principles involved in key areas of materials science and other engineering disciplines. Flexible electronics packaging materials to be discussed include metals, ceramics, and polymers.
When Offered Fall.
Regular Academic Session.
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Credits and Grading Basis
3 Credits Graded(Letter grades only)
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Class Number & Section Details
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Meeting Pattern
- TR Upson Hall 202
Instructors
Ober, C
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Additional Information
Instruction Mode: In Person
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